Abstract: Spiral inductors on semiconductor/insulator substrate play a crucial role in Radio Frequency Integrated Circuits (RFICs). For high frequency system circuitry, these components are realized using bond-wires or planar spirals. The Quality Factors (Q) of bond wires is higher than on-chip spirals, their use is constrained by the limited range of realizable inductances. The research presented here provides insight into some of the most pressing issues currently being addressed by the research community, and provides guidelines for designing these evolving heterogeneous Three Dimension (3D) systems. 3D spiral inductor integration is an evolving technology that will enhance the semiconductor roadmap for several generations. This dissertation provides insight into the 3-D inductor IC design process, with the goal of strengthening the design capabilities for 3-D integrated circuits and systems.
Keywords: Inductor, SiO2, Silicon, Glass, PEC.
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DOI:
10.17148/IJARCCE.2020.9718
